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CYCOM® 5320 is Cytec Engineered Materials’ newest toughened epoxy resin prepreg system. Designed specifically for out-of-autoclave (OOA) manufacturing, CYCOM 5320 provides autoclave-type material performance with the benefit of lower processing costs and manufacturing flexibility. This material allows for the design of large primary structures, without the autoclave costs and size limitations.

The low temperature curing capability of CYCOM 5320, coupled with the cost benefits, makes it ideal for many structural aerospace applications. Low cost tooling and OOA curing offers the distinct advantage of using one material for both prototype and high-rate production.

CYCOM 5320 offers the mechanical performance equivalent to 350°F/180°C autoclave-cured, toughened epoxy prepreg systems. With CYCOM 5320, you have the flexibility to vary the cure cycle from 200°F/8hr to 250°F/2hr (followed by a 350°F two-hour post cure). This flexibility provides a broad processing window with maximized mechanical properties. As CYCOM 5320 can be vacuum bag cured to produce autoclave-quality components, the non-recurring costs reduction offers a tangible financial benefit.

Features and benefits

• Developed for primary structures
• No autoclave required for cure
• Excellent hot/wet properties
• Mechanical properties equivalent to autoclave-cured toughened epoxy systems
• Very low void content
• Suitable for producing complex parts
• Enables low cost tooling
• Flexible cure cycles
• Mechanical properties equivalent to standard 350°F/177°C, autoclave cured epoxy after freestanding post cure

Notes:
(1) Degree of cure after initial 200°F (93°C) /8 hr cure is 52%. This allows for handling and free standing post cure.
(2) A combined cure and post cure on the tool may be performed by ramping to 250°F (121°C), hold for 1 hour, ramp to 350°F (177°C) and hold for 2 hours.